The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
본 연구에서는 금박으로 만든 금분말이 전도성 잉크의 충전재로서의 가능성을 조사하였다. 전도성 고분자(PEDOT:PSS) 잉크에 금분을 6.2wt%만 첨가하여 전도성 필름의 저항을 1kΩ에서 2.0Ω으로 감소시켰습니다. 저항의 변화는 금분의 특성에 따라 달라집니다. 더 작고 균일한 크기와 우수한 분산성을 지닌 금가루는 연속적인 삼출 네트워크를 형성하는 데 유리합니다.
Sayaka YAMASHITA
Japan Advanced Institute of Science and Technology
Heisuke SAKAI
Japan Advanced Institute of Science and Technology
Hideyuki MURATA
Japan Advanced Institute of Science and Technology
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
부
Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, "Application of Gold Powder Made from Gold Leaf for Conductive Inks" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 2, pp. 176-179, February 2019, doi: 10.1587/transele.2018OMS0009.
Abstract: In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018OMS0009/_p
부
@ARTICLE{e102-c_2_176,
author={Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Application of Gold Powder Made from Gold Leaf for Conductive Inks},
year={2019},
volume={E102-C},
number={2},
pages={176-179},
abstract={In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.},
keywords={},
doi={10.1587/transele.2018OMS0009},
ISSN={1745-1353},
month={February},}
부
TY - JOUR
TI - Application of Gold Powder Made from Gold Leaf for Conductive Inks
T2 - IEICE TRANSACTIONS on Electronics
SP - 176
EP - 179
AU - Sayaka YAMASHITA
AU - Heisuke SAKAI
AU - Hideyuki MURATA
PY - 2019
DO - 10.1587/transele.2018OMS0009
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 2019
AB - In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
ER -