The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
본 논문에서는 400Gbps 4채널 광통신 시스템을 위한 인쇄회로기판의 본딩 와이어와 동일 평면 도파관 전송선을 통한 광 모듈과 전기 모듈 간의 고속 상호 연결 설계를 제안한다. 상호 연결 대역폭을 확장하기 위해 최초로 서로 맞물린 커패시터가 GSG 패드 온 칩과 통합되었습니다. 시뮬레이션 결과에 따르면 반사 계수는 DC~10GHz에서 -53dB 미만이고 삽입 손실은 DC~1GHz에서 45dB 미만인 것으로 나타났습니다. 두 지표 모두 제안된 상호 연결 구조가 100Gbps 이상의 데이터 속도 PAM4 신호의 통신 대역폭 요구 사항을 효과적으로 충족할 수 있음을 보여줍니다.
Xiangyu MENG
Sun Yat-sen University
Yecong LI
Sun Yat-sen University
Zhiyi YU
Sun Yat-sen University
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부
Xiangyu MENG, Yecong LI, Zhiyi YU, "A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers" in IEICE TRANSACTIONS on Electronics,
vol. E106-C, no. 1, pp. 14-19, January 2023, doi: 10.1587/transele.2022ECP5011.
Abstract: This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2022ECP5011/_p
부
@ARTICLE{e106-c_1_14,
author={Xiangyu MENG, Yecong LI, Zhiyi YU, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers},
year={2023},
volume={E106-C},
number={1},
pages={14-19},
abstract={This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.},
keywords={},
doi={10.1587/transele.2022ECP5011},
ISSN={1745-1353},
month={January},}
부
TY - JOUR
TI - A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers
T2 - IEICE TRANSACTIONS on Electronics
SP - 14
EP - 19
AU - Xiangyu MENG
AU - Yecong LI
AU - Zhiyi YU
PY - 2023
DO - 10.1587/transele.2022ECP5011
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E106-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2023
AB - This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
ER -