The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
조회수
165
대규모 집적(LSI) 회로에서 3차원(1D) 광 상호 연결을 구현하기 위해 Si-포토닉스 플랫폼을 기반으로 하는 레이어 간 커플러가 검토되었습니다. 광학 누화 측면에서 3D 상호 연결에는 100μm 이상의 레이어 거리가 필요합니다. 레이어 간 광 커플러에 대한 이러한 요구 사항을 충족하기 위해 우리는 다층 거리 커플 링을 위한 금속 거울이 있는 한 쌍의 격자 커플러와 인접 레이어 거리 커플 링을 위한 테이퍼 유형 방향성 커플러의 두 가지 유형의 커플러를 제안했습니다. 두 구조 모두 CMOS(Complementary Metal Oxide Semiconductor) 호환 제조 공정을 통해 상대적으로 작은(~XNUMXμm) 장치 크기로 높은 결합 효율을 생성했습니다.
Nobuhiko NISHIYAMA
Tokyo Institute of Technology
JoonHyun KANG
Tokyo Institute of Technology
Yuki KUNO
Tokyo Institute of Technology
Kazuto ITOH
Tokyo Institute of Technology
Yuki ATSUMI
Tokyo Institute of Technology
Tomohiro AMEMIYA
Tokyo Institute of Technology
Shigehisa ARAI
Tokyo Institute of Technology
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부
Nobuhiko NISHIYAMA, JoonHyun KANG, Yuki KUNO, Kazuto ITOH, Yuki ATSUMI, Tomohiro AMEMIYA, Shigehisa ARAI, "Si-Photonics-Based Layer-to-Layer Coupler Toward 3D Optical Interconnection" in IEICE TRANSACTIONS on Electronics,
vol. E101-C, no. 7, pp. 501-508, July 2018, doi: 10.1587/transele.E101.C.501.
Abstract: To realize three-dimensional (3D) optical interconnection on large-scale integration (LSI) circuits, layer-to-layer couplers based on Si-photonics platform were reviewed. In terms of optical cross talk, more than 1 µm layer distance is required for 3D interconnection. To meet this requirement for the layer-to-layer optical coupler, we proposed two types of couplers: a pair of grating couplers with metal mirrors for multi-layer distance coupling and taper-type directional couplers for neighboring layer distance coupling. Both structures produced a high coupling efficiency with relatively compact (∼100 µm) device sizes with a complementary metal oxide semiconductor (CMOS) compatible fabrication process.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E101.C.501/_p
부
@ARTICLE{e101-c_7_501,
author={Nobuhiko NISHIYAMA, JoonHyun KANG, Yuki KUNO, Kazuto ITOH, Yuki ATSUMI, Tomohiro AMEMIYA, Shigehisa ARAI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Si-Photonics-Based Layer-to-Layer Coupler Toward 3D Optical Interconnection},
year={2018},
volume={E101-C},
number={7},
pages={501-508},
abstract={To realize three-dimensional (3D) optical interconnection on large-scale integration (LSI) circuits, layer-to-layer couplers based on Si-photonics platform were reviewed. In terms of optical cross talk, more than 1 µm layer distance is required for 3D interconnection. To meet this requirement for the layer-to-layer optical coupler, we proposed two types of couplers: a pair of grating couplers with metal mirrors for multi-layer distance coupling and taper-type directional couplers for neighboring layer distance coupling. Both structures produced a high coupling efficiency with relatively compact (∼100 µm) device sizes with a complementary metal oxide semiconductor (CMOS) compatible fabrication process.},
keywords={},
doi={10.1587/transele.E101.C.501},
ISSN={1745-1353},
month={July},}
부
TY - JOUR
TI - Si-Photonics-Based Layer-to-Layer Coupler Toward 3D Optical Interconnection
T2 - IEICE TRANSACTIONS on Electronics
SP - 501
EP - 508
AU - Nobuhiko NISHIYAMA
AU - JoonHyun KANG
AU - Yuki KUNO
AU - Kazuto ITOH
AU - Yuki ATSUMI
AU - Tomohiro AMEMIYA
AU - Shigehisa ARAI
PY - 2018
DO - 10.1587/transele.E101.C.501
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E101-C
IS - 7
JA - IEICE TRANSACTIONS on Electronics
Y1 - July 2018
AB - To realize three-dimensional (3D) optical interconnection on large-scale integration (LSI) circuits, layer-to-layer couplers based on Si-photonics platform were reviewed. In terms of optical cross talk, more than 1 µm layer distance is required for 3D interconnection. To meet this requirement for the layer-to-layer optical coupler, we proposed two types of couplers: a pair of grating couplers with metal mirrors for multi-layer distance coupling and taper-type directional couplers for neighboring layer distance coupling. Both structures produced a high coupling efficiency with relatively compact (∼100 µm) device sizes with a complementary metal oxide semiconductor (CMOS) compatible fabrication process.
ER -