The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
집적 회로 제조의 크기 축소로 인해 비아 결함 발생이 증가합니다. 중복 비아 삽입은 비아 오류로 인한 수율 손실을 줄이는 효과적이고 권장되는 방법입니다. 본 논문에서는 레이어 분할 기반 중복을 통한 삽입 방법[1]에 대한 중복을 통한 할당 문제를 소개하고 유전자 알고리즘을 사용하여 이를 해결합니다. 동시에 우리는 비아 밀도 규칙에 적합한 비아 밀도의 균형을 맞추기 위해 볼록 비용 흐름 모델을 사용합니다. 레이어 분할 기반 모델의 결과는 금속 레이어의 분할 및 처리 순서에 따라 달라집니다. 게다가 모든 파티션과 처리 순서를 시도하더라도 최적의 솔루션을 놓칠 수도 있습니다. 분할 경계에 중복 할당 문제를 도입함으로써 원래 레이어 분할 기반 방법의 차선책을 피할 수 있습니다. 실험 결과는 제안한 방법이 평균 12개의 중복 비아를 더 많이 삽입하여 비아 밀도 균형이 크게 향상되었음을 보여줍니다.
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부
Song CHEN, Jianwei SHEN, Wei GUO, Mei-Fang CHIANG, Takeshi YOSHIMURA, "Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density" in IEICE TRANSACTIONS on Fundamentals,
vol. E93-A, no. 12, pp. 2372-2379, December 2010, doi: 10.1587/transfun.E93.A.2372.
Abstract: The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1587/transfun.E93.A.2372/_p
부
@ARTICLE{e93-a_12_2372,
author={Song CHEN, Jianwei SHEN, Wei GUO, Mei-Fang CHIANG, Takeshi YOSHIMURA, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density},
year={2010},
volume={E93-A},
number={12},
pages={2372-2379},
abstract={The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.},
keywords={},
doi={10.1587/transfun.E93.A.2372},
ISSN={1745-1337},
month={December},}
부
TY - JOUR
TI - Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 2372
EP - 2379
AU - Song CHEN
AU - Jianwei SHEN
AU - Wei GUO
AU - Mei-Fang CHIANG
AU - Takeshi YOSHIMURA
PY - 2010
DO - 10.1587/transfun.E93.A.2372
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E93-A
IS - 12
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - December 2010
AB - The occurrence of via defects increases due to the shrinking size in integrated circuit manufacturing. Redundant via insertion is an effective and recommended method to reduce the yield loss caused by via failures. In this paper, we introduce the redundant via allocation problem for layer partition-based redundant via insertion methods [1] and solve it using the genetic algorithm. At the same time, we use a convex-cost flow model to equilibrate the via density, which is good for the via density rules. The results of layer partition-based model depend on the partition and processing order of metal layers. Furthermore, even we try all of partitions and processing orders, we might miss the optimal solutions. By introducing the redundant via allocation problem on partitioning boundaries, we can avoid the sub-optimality of the original layer-partition based method. The experimental results show that the proposed method got 12 more redundant vias inserted on average and the via density balance can be greatly improved.
ER -